Epoxym is a user-friendly solution for duplicating SU8 master wafers into molds, creating durable epoxy resin duplicates that can be reused multiple times. The Epoxym replica mold is recommended for precise and consistent embossing applications, resulting in high-quality finished products.
General
The Epoxym is designed to enable the creation of molds that are exact replicas of other materials. Replica molds produced using the Epoxym kit have high thermal resistance and can be used up to hundreds of times without microstructure damage or deterioration. The process involves a two-step system beginning with creating a counter mold, typically made of polydimethylsiloxane. Subsequently, this mold is utilized to create an epoxy resin replica of the initial master mold.
The mold frame is made up of two primary components: the base or bottom of the frame and the frame lid. A small hole located in the center of the base enables the creation of a vacuum seal during the molding process. The vacuum can be controlled using a vacuum valve. Meanwhile, the lid features a large circular opening in the center, which is used for the mold-casting process. To complete the setup, the frame is connected to the vacuum pumping system through an adapter.
Features and Benefits
Epoxym benefits
- monolithic and robust mold
- high replication fidelity: 0.2 μm
- high-temperature resistant Epoxym mold (180 °C)
- produce 1 to 7 mm thick molds suitable for repetitive embossing
- two-step fabrication-old up to 4-inch
Epoxy Resin Mold benefits
- high-temperature resistance
- withstands a high number of molding cycles
- more robust than silicon wafers
- saves time and money
Applications
- soft thermoplastic molding
- microfabrication
- microfluidic fabrication
Content
1x Epoxym base with valve
1x Epoxym mold frame for PDMS
1x Epoxym mold frame for epoxy
1x O-ring, FKM 126 x 3 mm
1x Flexdym seal sheet
1x Epoxy resin and hardener
1x Silicone spray
Additional material required
The following items are essential for the final application and are not included:
- PDMS (base and curing agent)
- Master mold, oven, hot plate
- Desiccator
- Vacuum pump with 6 mm OD tubing
- Ethanol or isopropanol
- Adhesive tape, tweezers, scalpel
Specifications
Technical specifications
Dimension | 16 x 23 x 6.5 cm3 |
Vacuum inlet | 6 mm rigid tubing |
Wetted materials | AI and FKM |
Weight | 1.35 kg |
Creation of the counter mold (usually made of PDMS)
Maximum master size | up to 4" in diameter |
Maximum master thickness | 8 mm |
Operating temperature | 0 - 90 °C |
Creation of the epoxy resin replica
Counter mold thickness | 3 to 7 mm |
Operating temperature | 0 - 140 °C |
Documentation
References
- Lachaux et al., Lab on a Chip 2016, L2017 Jul 25;17(15):2581-2594. doi: 10.1039/c7lc00488e
- Perrault et al. Insights on Polymers for Microfluidics Applied to Biomedical Applications
- Overview of Materials for Microfluidic Applications, IntechOpen 2016
- Roy et al., Lab on a Chip 2015,LabChip, 2015,15, 406-416, doi:10.1039/C4LC00947A
Epoxym is a user-friendly solution for duplicating SU8 master wafers into molds, creating durable epoxy resin duplicates that can be reused multiple times. The Epoxym replica mold is recommended for precise and consistent embossing applications, resulting in high-quality finished products.
General
The Epoxym is designed to enable the creation of molds that are exact replicas of other materials. Replica molds produced using the Epoxym kit have high thermal resistance and can be used up to hundreds of times without microstructure damage or deterioration. The process involves a two-step system beginning with creating a counter mold, typically made of polydimethylsiloxane. Subsequently, this mold is utilized to create an epoxy resin replica of the initial master mold.
The mold frame is made up of two primary components: the base or bottom of the frame and the frame lid. A small hole located in the center of the base enables the creation of a vacuum seal during the molding process. The vacuum can be controlled using a vacuum valve. Meanwhile, the lid features a large circular opening in the center, which is used for the mold-casting process. To complete the setup, the frame is connected to the vacuum pumping system through an adapter.
Features and Benefits
Epoxym benefits
- monolithic and robust mold
- high replication fidelity: 0.2 μm
- high-temperature resistant Epoxym mold (180 °C)
- produce 1 to 7 mm thick molds suitable for repetitive embossing
- two-step fabrication-old up to 4-inch
Epoxy Resin Mold benefits
- high-temperature resistance
- withstands a high number of molding cycles
- more robust than silicon wafers
- saves time and money
Applications
- soft thermoplastic molding
- microfabrication
- microfluidic fabrication
Content
1x Epoxym base with valve
1x Epoxym mold frame for PDMS
1x Epoxym mold frame for epoxy
1x O-ring, FKM 126 x 3 mm
1x Flexdym seal sheet
1x Epoxy resin and hardener
1x Silicone spray
Additional material required
The following items are essential for the final application and are not included:
- PDMS (base and curing agent)
- Master mold, oven, hot plate
- Desiccator
- Vacuum pump with 6 mm OD tubing
- Ethanol or isopropanol
- Adhesive tape, tweezers, scalpel
Specifications
Technical specifications
Dimension | 16 x 23 x 6.5 cm3 |
Vacuum inlet | 6 mm rigid tubing |
Wetted materials | AI and FKM |
Weight | 1.35 kg |
Creation of the counter mold (usually made of PDMS)
Maximum master size | up to 4" in diameter |
Maximum master thickness | 8 mm |
Operating temperature | 0 - 90 °C |
Creation of the epoxy resin replica
Counter mold thickness | 3 to 7 mm |
Operating temperature | 0 - 140 °C |
Documentation
References
- Lachaux et al., Lab on a Chip 2016, L2017 Jul 25;17(15):2581-2594. doi: 10.1039/c7lc00488e
- Perrault et al. Insights on Polymers for Microfluidics Applied to Biomedical Applications
- Overview of Materials for Microfluidic Applications, IntechOpen 2016
- Roy et al., Lab on a Chip 2015,LabChip, 2015,15, 406-416, doi:10.1039/C4LC00947A